本研究旨在研究筆記型電腦散熱鰭片的幾何尺寸變化對於高效能活動（如遊戲或影像製作）時的散熱效能有何影響。此研究是在仁寶公司 (Compal)熱部門實習期間進行，專注於戴爾公司(Dell)新款G系列遊戲筆記型電腦。 模擬和實際實驗所得結果顯示，修改後的筆記型電腦散熱鰭片在散熱性能方面有顯著改善。後部鰭片幾何尺寸的變化提升了散熱能力，從而在高效能活動（如遊戲或影像製作）期間降低了關鍵元件的溫度。 三維模型模擬表明，修改後的設計有效增加了散熱傳遞的表面積，並改善了鰭片的氣流通過情況。這種優化的散熱效果使得溫度降低，整體系統穩定性提高，減少了熱節點和潛在性能下降的風險。實際原型進一步驗證了模擬結果，顯示在高工作負載條件下筆記型電腦的溫度明顯降低。通過與原始熱模塊的比較，改進後的原型展示了更高的散熱性能。

This study aimed to determine how the laptop heat dissipation fins, which are most used for high-performance activities like gaming or producing video functions when their geometrical dimensions are varied. The research was conducted during an internship at the Thermal Department of Compal Electronic Company, particularly with the Dell new G series gaming laptop. The results obtained from the simulations and real experiments showed significant improvements in the thermal performance of the modified laptop heat dissipation fins. The variations in the geometrical dimensions of the rear side fins led to enhanced heat dissipation capabilities, thereby reducing the temperature of critical components during high-performance activities such as gaming or video production. The 3D model simulations demonstrated that the modified design effectively increased the surface area available for heat transfer and improved airflow through the fins. This optimized heat dissipation resulted in lower temperatures and improved overall system stability, reducing the risk of thermal throttling and potential performance degradation. The physical prototypes further validated. the simulation results, showcasing a notable reduction in the temperature of the laptop under high workload conditions. The improved prototype's increased cooling performance has been shown by comparing it against the original thermal module

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