肖华攀，中山大学先进制造学院副教授，硕士生导师、博士生导师。
长期从事脆性光电材料（玻璃、晶体、陶瓷等）精密/超精密加工及检测技术研究，尤其在加工表面和亚表面损伤的形成机理、预测理论、检测方法与抑制技术等方面具有较为丰富的研究经验；主持国家自然科学基金青年项目、广东省自然科学基金面上项目等科研项目3项，参与国家自然科学基金面上项目、国家重点研发计划项目、香港创新及科技基金项目等科研项目6项；发表学术论文50余篇，其中在Int J Mech Sci、J Mater Process Technol、Precis Eng、Int J Precis Eng Manuf Technol、Opt Express、Opt Laser Technol、Ultrasonics、Struct Health Monit、Tribol Int、Ceram Int等SCI期刊上发表论文35篇（一作/通讯14篇），授权/申请国家发明专利15项；获亚洲精密工程与纳米技术学会“青年研究奖”、国家公派出国留学奖学金、西安交大优秀研究生、省优秀硕士学位论文等荣誉。
课题组及所在团队经费和招生名额充足，长期
招收机械工程、光学工程、力学、声学、计算机科学与技术、材料科学与工程等专业的硕士研究生、博士研究生和博士后。
欢迎从事精密/超精密加工及检测相关领域的高校、科研院所与企业来学习交流合作。
电子邮箱：
xiaohp6@mail.sysu.edu.cn
通讯地址：广东省深圳市光明区公常路66号 中山大学理学园-西517
学术主页
：
https://www.researchgate.net/profile/Huapan-Xiao
（
ResearchGate
）
学术
主页
：
https://scholar.google.com/citations?hl=zh-CN&user=AH7zktAAAAAJ
（
Google Scholar
）
教育工作经历
2024.05 - 至今，中山大学先进制造学院 ，副教授
2021.11 - 2024.05，香港理工大学超精密加工技术国家重点实验室，博士后研究员
2020.07 - 2021.11，重庆大学机械与运载工程学院，弘深青年教师
2015.09 - 2020.03，西安交通大学机械工程学院，博士
2018.10 - 2019.10，亚利桑那大学Wyant光学科学学院，CSC联合培养博士
《材料力学》、《精密和超精密加工技术》、《结构优化设计》
1
、
（超声/磁/光/电/热等多场辅助）精密/超精密磨粒加工
2
、
多能场辅助湿法刻蚀技术
3
、
线性/非线性超声无损检测、结构健康监测
4、深度学习、机器视觉、智能检测
1
、
第17届中日超精密加工国际会议（CJUMP 2023）组委会委员、分会场主席
2、
第10届亚洲精密工程及纳米技术国际会议（ASPEN 2023）组委会委员、分会场主席
3、
第8届亚太光学制造会议暨第3届国际先进光学制造青年科学家论坛（APCOM 2023 & YSAOM 2023）组委会委员、邀请报告
4、
Frontiers in Materials（IF: 3.985）、Micromachines（IF: 3.523）客座编辑
5、
International Journal of Mechanical Sciences, Journal of Materials Processing Technology, Precision Engineering, Ceramic International, Measurement, Scientific Reports, Journal of Non-Crystalline Solids, Optics Express, Optical Materials Express, Optics Communications, Applied Optics, Optical Engineering, Materials Today Communications, Applied Physics B等近20种SCI 期刊审稿人
[1] Zhou P, Cheung CF*,
Xiao H
*, Wang C. The chip generation and removal mechanisms of thermal-assisted polishing monocrystalline 4 H-SiC. Tribol Int 2024;194:109504.
[
2
]
Xiao H
, Yin S, Cheung CF, Wang C. Cracking behavior during scratching brittle materials with different-shaped indenters. Int J Mech Sci 2024;268:109041.
[3] Wu H, Luo S, Chen M,
Xiao H
, Wang T, He C. Super-resolution image restoration for microlens array imaging system. Opt Laser Technol 2024;170:110139.
[4] Lu Y, Mou X,
Xiao H
*, Li K, Wang C*. Surface integrity of binderless WC using dry electrical discharge assisted grinding. Int J Precis Eng Manuf Technol 2024.
[5] Yin S,
Xiao H
, Xu C, Deng M, Kundu T. Theoretical error formation and evaluation of acoustic source localization for cluster-based techniques. Ultrasonics 2023;132:106982.
[
6
]
Xiao H
, Zhang F, Yin S, Cheung CF, Wang C. Subsurface damage model in single and double scratching of fused silica with a blunt indenter. Int J Mech Sci 2023;250:108309.
[
7
]
Xiao H
, Yin S, Cheung CF, Zhang F, Cao H, Wang C. Material removal behavior analysis of ZnSe crystal during side-forward nanoscratching. Int J Mech Sci 2023;241:107968.
[8] Wu H, Hao X, Wu J,
Xiao H
, He C, Yin S. Deep learning-based image super-resolution restoration for mobile infrared imaging system. Infrared Phys Technol 2023;132:104762.
[9] Liu Y, Huang X, Cao H, Wang J,
Xiao H
. Model of surface texture for honed gear considering motion path and geometrical shape of abrasive particle. Chin J Mech Eng 2023;36:96.
[10] Guo C, Zhou A, He J,
Xiao H
, Li D. An investigation in sub-millimeter channel fabrication by the non-aqueous electrolyte jet machining of Zr-Based bulk metallic glasses. Micromachines 2023;14:2232.
[11] Gao R, Jiang C, Ye H,
Xiao H
, Cheung CF, Wang C. Exploring the potential of the fabrication of large-size mirror facet for semiconductor laser bar utilizing mechanical cleavage. Ceram Int 2023;49:21883-21891.
[12] Yin S,
Xiao H
, Xu C, Wang J, Deng M, Kundu T. Microcrack localization using nonlinear Lamb waves and cross-shaped sensor clusters. Ultrasonics 2022;124:106770.
[13] Yin S,
Xiao H
*, Wu H, Wang C, Cheung CF. Image-processing-based model for the characterization of surface roughness and subsurface damage of silicon wafer in diamond wire sawing. Precis Eng 2022;77:263-274.
[13] Yin S,
Xiao H
*, Kang W, Wu H, Liang R. Shoulder damage model and its application for single point diamond machining of ZnSe crystal. Materials 2022;15:233.
[
14
]
Xiao H
, Yin S, Wu H, Wang H, Liang R. Theoretical model and digital extraction of subsurface damage in ground fused silica. Opt Express 2022;30:17999-18017.
[15] Kang W, Seigo M,
Xiao H
, Wang D, Liang R. Experimental studies on fabricating lenslet array with slow tool servo. Micromachines 2022;13:1564.
[16]
Yin S,
Xiao H
, Cui Z, Kundu T. Rapid localization of acoustic source using sensor clusters in 3D homogeneous and heterogeneous structures. Struct Health Monit 2021;20:1145-1155.
[17]
Xiao H
, Yin S, Wang H, Liu Y, Wu H, Liang R, Cao H. Models of grinding-induced surface and subsurface damages in fused silica considering strain rate and micro shape/geometry of abrasive. Ceram Int 2021;47:24924-24941.
[18]
Wu H, Zhao G, Chen M, Cheng L,
Xiao H
, Xu L, Wang D, Liang J, Xu Y. Hybrid neural network-based adaptive computational ghost imaging. Opt Lasers Eng 2021;140:106529.
[19]
Wu H, Wu W, Chen M, Luo S, Zhao R, Xu L,
Xiao H
, Cheng L, Zhang X, Xu Y. Computational ghost imaging with 4-step iterative rank minimization. Phys Lett A 2021;394:127199.
[20]
Wang T, Chen M, Wu H,
Xiao H
, Luo S, Cheng L. Underwater compressive computational ghost imaging with wavelet enhancement. Appl Opt 2021;60:6950-6957.
[21]
李雨菡,
肖华攀
, 王海容, 梁晓雅, 李昌朋, 叶鑫, 蒋晓东, 苗心向, 姚彩珍, 孙来喜. 湿法刻蚀处理熔石英光学元件研究进展. 激光与光电子学进展 2021;58:1516026.
[22]
Zhang Y, Yin S, Liang R, Luo H,
Xiao H
, Yuan N. New testing and calculation method for determination viscoelasticity of optical glass. Opt Express 2020;28:626-640.
[23 ]
Wu H, Zhao G, Wang R,
Xiao H
, Wang D, Liang J, Cheng L, Liang R. Computational ghost imaging system with 4-connected-region-optimized Hadamard pattern sequence. Opt Lasers Eng 2020;132:106105.
[24]
Wu H, Wang R, Zhao G,
Xiao H
, Wang D, Liang J, Tian X, Cheng L, Zhang X. Sub-Nyquist computational ghost imaging with deep learning. Opt Express 2020;28:3846-3853.
[25]
Wu H, Wang R, Zhao G,
Xiao H
, Liang J, Wang D, Tian X, Cheng L, Zhang X. Deep-learning denoising computational ghost imaging. Opt Lasers Eng 2020;134:106183.
[26]
Wu H, Wang R, Huang Z,
Xiao H
, Liang J, Wang D, Tian X, Wang T, Cheng L. Online adaptive computational ghost imaging. Opt Lasers Eng 2020;128:106028.
[27]
Xiao H
, Wang H, Yu N, Liang R, Tong Z, Chen Z, Wang J. Evaluation of fixed abrasive diamond wire sawing induced subsurface damage of solar silicon wafers. J Mater Process Technol 2019;273:116267.
[28]
Xiao H
, Liang R, Spires O, Wang H, Wu H, Zhang Y. Evaluation of surface and subsurface damages for diamond turning of ZnSe crystal. Opt Express 2019;27:28364.
[29]
Xiao H
, Chen Z, Wang H, Wang J, Zhu N. Effect of grinding parameters on surface roughness and subsurface damage and their evaluation in fused silica. Opt Express 2018;26:4638-4655.
[30]
Xiao H
, Wang H, Fu G, Chen Z. Surface roughness and morphology evolution of optical glass with micro-cracks during chemical etching. Appl Opt 2017;56:702-711.
[31]
Xiao H
, Wang H, Chen Z, Fu G, Wang J. Effect of brittle scratches on transmission of optical glass and its induced light intensification during the chemical etching. Opt Eng 2017;56:1.
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[2]基于硅基集成空芯光波导的多组分气体检测方法及装置
[3]光学元件亚表面损伤的化学刻蚀测量方法、辅助实验装置及试验方法
[4]厚度可调的切片装置
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[10]一种具有防水倒灌功能的水下动力增压排气装置
[11]组合式联轴器
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